Datasheet

ADP320
Rev. A | Page 19 of 20
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of the
ADP320 triple LDO. However, as can be seen from Table 6, a
point of diminishing returns eventually is reached, beyond
which an increase in the copper size does not yield significant
heat dissipation benefits.
Place the input capacitor as close as possible to the VINx and
GND pins. Place the output capacitors as close as possible to
the VOUTx and GND pins. Use 0402 or 0603 size capacitors
and resistors to achieve the smallest possible footprint solution
on boards where area is limited.
09874-051
Figure 51. Example of PCB Layout, Top Side
09874-052
Figure 52. Example of PCB Layout, Bottom Side