Datasheet

Data Sheet ADP2442
Rev. 0 | Page 5 of 36
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VIN to PGND −0.3 V to +40 V
EN to AGND
−0.3 V to +40 V
SW to PGND −0.3 V to +40 V
BST to PGND −0.3 V to +45 V
VCC to AGND −0.3 V to +6 V
BST to SW −0.3 V to +6 V
FREQ, PGOOD, SYNC/MODE, COMP,
FB to AGND
−0.3 V to +6 V
PGND to AGND ±0.3 V
Operating Junction Temperature
Range
−40°C to +125°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 10 sec) 260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages based on
a 4-layer standard JEDEC board.
Table 3. Thermal Resistance
Package Type
θ
JA
θ
JC
Unit
12-Lead LFCSP 40 2.4 °C/W
ESD CAUTION