Datasheet

Data Sheet ADP2386
Rev. A | Page 23 of 24
OUTLINE DIMENSIONS
0.50
BSC
0.50
0.40
0.30
0.25
0.20
0.15
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD .
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.203 REF
0.20 MIN
0.20
MIN
0.20
MIN
0.20
MIN
COPLANARITY
0.08
PIN 1
INDICATOR
1
24
7
12
13
18
19
6
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
2.80
2.70
2.60
1.05
0.95
0.85
0.45
0.35
0.25
1.50
1.40
1.30
01-14-2013-B
EXPOSED
PAD
EXPOSED
PAD
Figure 40. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-24-12)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range
Package Description
Package Option
ADP2386ACPZN-R7 −40°C to +125°C 24-Lead LFCSP_WQ, 7” Tape and Reel CP-24-12
ADP2386-EVALZ
Evaluation Board
ADP2386BB-EVALZ Inverting Buck-Boost Evaluation Board
1
Z = RoHS Compliant Part.