Datasheet

Data Sheet ADP2384
Rev. 0 | Page 23 of 24
OUTLINE DIMENSIONS
0.50
BSC
0.50
0.40
0.30
0.25
0.20
0.15
COMPLIANT
TO JEDEC STANDARDS MO-220-WGGD .
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.203 REF
COPLANARITY
0.08
PIN 1
INDICATOR
1
24
7
12
13
18
19
6
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
2.80
2.70
2.60
1.05
0.95
0.85
0.45
0.35
0.25
1.50
1.40
1.30
06-24-2010-A
EXPOSED
PAD
EXPOSED
PAD
Figure 40. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-24-12)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Packing
ADP2384ACPZN-R7 −40°C to +125°C 24-Lead LFCSP_WQ CP-24-12 7” Tape and Reel
ADP2384-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.