Datasheet

Data Sheet ADP2380
Rev. 0 | Page 5 of 28
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
PVIN, PGOOD 0.3 V to +22 V
SW
−1 V to +22 V
BST V
SW
+ 6 V
UVLO, FB, EN/SS, COMP, SYNC, RT
0.3 V to +6 V
VREG, LD 0.3 V to +12 V
PGND to GND 0.3 V to +0.3 V
Operating Junction Temperature Range 40°C to +125°C
Storage Temperature Range
65°C to +150°C
Soldering Conditions JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to GND.
THERMAL INFORMATION
Table 3. Thermal Resistance
Package Type
θ
JA
Unit
16-lead TSSOP_EP 39.48 °C/W
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in circuit board (4-layer, JEDEC standard board) for
surface-mount packages.
ESD CAUTION