Datasheet

ADP2323 Data Sheet
Rev. A | Page 6 of 32
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
PVIN1, PVIN2, EN1, EN2 −0.3 V to +22 V
SW1, SW2
−1 V to +22 V
BST1, BST2 V
SW
+ 6 V
FB1, FB2, SS1, SS2,COMP1, COMP2,
PGOOD1, PGOOD2, TRK1, TRK2, SCFG,
SYNC, RT, MODE
−0.3 V to +6 V
INTVCC, VDRV, DL1, DL2 −0.3 V to +6 V
PGND to GND −0.3 V to +0.3 V
Temperature Range
Operating (Junction) −40°C to +125°C
Storage
−65°C to +150°C
Soldering Conditions JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Boundary Condition
θ
JA
is measured using natural convection on a JEDEC 4-layer
board, and the exposed pad is soldered to the printed circuit
board (PCB) with thermal vias.
Table 3. Thermal Resistance
Package Type θ
JA
Unit
32-Lead LFCSP_WQ 32.7 °C/W
ESD CAUTION