Datasheet

ADP222/ADP223/ADP224/ADP225 Data Sheet

Rev. D | Page 22 of 24

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

Heat dissipation from the package can be improved by

increasing the amount of copper attached to the pins of the

ADP222/ADP223/ADP224/ADP225. However, as listed in

Table 6, a point of diminishing returns is eventually reached

beyond which an increase in the copper size does not yield

significant heat dissipation benefits.

Place the input capacitor as close as possible to the VIN and

GND pins. Place the output capacitor as close as possible to the

VOUTx and GND pins. Use of 0402 or 0603 size capacitors and

resistors achieves the smallest possible footprint solution on

boards where area is limited.

09376-052

TB2

TB5

EN1

R1 R2

VOUT1

TB6

ADP223 - ________- EVALZ

VOUT2

TB7

GND

ANALOG

DEVICES

TB1

GND

TB4

VIN

TB3

EN2

Figure 76. Example 8-Lead LFCSP PCB Layout