Datasheet

Data Sheet ADP220/ADP221
Rev. H | Page 17 of 20
OUTLINE DIMENSIONS
11-08-2012-B
A
B
C
0.675
0.595
0.515
0.380
0.355
0.330
0.270
0.240
0.210
1.000
0.950
0.900
1.500
1.450
1.400
12
BOT
T
OM VIEW
(BAL
L SIDE UP)
T
OP
VIEW
(BAL
L SIDE DOWN)
SIDE VIEW
0.345
0.295
0.245
1.00
REF
0.50
BSC
BAL
L A1
IDENTIFIER
SEA
TING
PLANE
0.50 BSC
COPLANARITY
0.075
Figure 42. 6-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-6-2)
Dimensions show in millimeters
0.50 REF
1.00
REF
1.50
1.46
1.42
1.00
0.96
0.92
0.50
REF
A
12
B
C
TOP VIEW
(BALL SIDE DOWN)
BOTTOM VIEW
(BALL SIDE UP)
BALL A1
IDENTIFIER
08-15-2012-A
0.225 NOM
0.09 NOM
0.330
0.315
0.300
END VIEW
0.200
0.170
0.140
COPLANARITY
0.05 NOM
SEATING
PLANE
Figure 43. 6-Ball Bumped Bare Die Sales [BUMPED_CHIP]
(CD-6-7)
Dimensions show in millimeters