Datasheet

ADP220/ADP221 Data Sheet
Rev. H | Page 16 of 20
PRINTED CIRCUIT BOARD (PCB) LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of the
ADP220/ADP221. However, as shown in Table 6, a point of
diminishing returns eventually is reached, beyond which an
increase in the copper size does not yield significant heat
dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitors as close as possible to
the VOUT1, VOUT2, and GND pins. Use 0402 or 0603
size capacitors and resistors to achieve the smallest possible
footprint solution on boards where area is limited.
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Figure 40. Example of PCB Layout, Top Side
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Figure 41. Example of PCB Layout, Bottom Side