Datasheet

EVAL-ADP220/ADP221
Rev. 0 | Page 7 of 8
PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP220/ADP221.
Here are a few general tips when designing PCBs:
• Place the input capacitor as close as possible to the VIN
and GND pins.
• Place the output capacitors as close as possible to the
VOUT1, VOUT2, and GND pins.
• Use 0402 or 0603 size capacitors and resistors to achieve
the smallest possible footprint solution on boards where
area is limited.
07575-009
Figure 9. Typical Board Layout, Top Side
07575-010
Figure 10. Typical Board Layout, Bottom Side