Datasheet

Data Sheet ADP2164
Rev. A | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
PVIN, VIN, SW −0.3 V to +7 V
FB, SYNC, TRK, RT, EN, PGOOD
−0.3 V to +7 V
PGND to GND −0.3 V to +0.3 V
Operating Junction Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Soldering Conditions JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is measured using natural convection on a JEDEC 4-layer
board. The exposed pad is soldered to the printed circuit board
with thermal vias.
Table 3. Thermal Resistance
Package Type
θ
JA
Unit
16-Lead LFCSP 38.3 °C/W
ESD CAUTION