Datasheet

ADP2147
Rev. 0 | Page 16 of 16
OUTLINE DIMENSIONS
12-07-2010-A
A
B
C
0.640
0.595
0.550
0.370
0.355
0.340
0.270
0.240
0.210
1.070
1.030
0.990
1.545
1.505
1.465
12
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
SIDE VIEW
0.340
0.320
0.300
1.00
REF
0.50
REF
BALL A1
IDENTIFIER
SEATING
PLANE
0.50 REF
COPLANARITY
0.05
Figure 38. 6-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-6-12)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature
Range
V
OUT
(V)
(VSEL = 0)
V
OUT
(V)
(VSEL = 1) Package Description
Package
Option Branding
ADP2147ACBZ-110-R7 −40°C to +125°C 1.275 0.981 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-12 LLE
ADP2147ACBZ-130-R7 −40°C to +125°C 0.9 1.3 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-12 LLF
ADP2147ACBZ-150-R7 −40°C to +125°C 1.2 1.0 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-12 LLG
ADP2147ACBZ-170-R7 −40°C to +125°C 0.9 1.1 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-12 LLH
ADP2147CB-110EVALZ Evaluation Board
ADP2147CB-130EVALZ Evaluation Board
ADP2147CB-150EVALZ Evaluation Board
ADP2147CB-170EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
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D09885-0-5/11(0)