Datasheet

Data Sheet ADP2126/ADP2127
Rev. B | Page 17 of 20
OUTLINE DIMENSIONS
0.40 REF
0.80
REF
1.340
1.300
1.260
0.940
0.900
0.860
0.40
REF
A
12
B
C
TOP VIEW
(BALL SIDE DOWN)
BOTTOM VIEW
(BALL SIDE UP)
BALL A1
IDENTIFIER
05-10-2010-A
0.225 TYP
0.09 TYP
0.330
0.315
0.300
END VIEW
0.190
0.170
0.150
COPLANARITY
0.05 NOM
SEATING
PLANE
Figure 33. 6-Ball Bumped Bare Die Sales [BUMPED_CHIP]
(CD-6-4)
Dimensions shown in millimeters
04-25-2011-A
0.40 REF
0.80
REF
1.340
1.300
1.260
0.940
0.900
0.860
SEATING
PLANE
0.200
0.175
0.150
A
12
B
C
TOP VIEW
(PAD SIDE DOWN)
BOTTOM VIEW
(PAD SIDE UP)
0.17
DIA.
DETAIL A
BARE Cu FIDUCIAL
0.15 DIA.
DETAIL A
ROTATED 90° CCW
0.008
MIN
0.40
PAD PITCH
0.13
DIA.
Figure 34. 6-Pad Embedded Wafer Level Package [EWLP]
(CN-6-1)
Dimensions shown in millimeters
DIRECTION OF FEED
THE ADP2126 HAS AN A1 BALL IDENTIFIER THAT IS VISIBLE
ON THE TOP OF THE PART.
THE ADP2127 HAS NO VISIBLE MARKING ON THE TOP,
BUT THE A1 PIN LOCATION IS THE SAME.
1
A
B
C
2
09658-035
Figure 35. Tape and Reel Orientation for the ADP2126/ADP2127