Datasheet

ADP2125
Rev. A | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VIN to GND −0.3 V to +6 V
EXTCLK to GND −0.3 V to +6 V
SW, NC to GND −0.3 V to VIN
FB (VIN ≥ 3.6 V) to GND −0.3 V to +3.6 V
FB (VIN < 3.6 V) to GND −0.3 V to VIN
Operating Ambient Temperature (T
A
) –40°C to +85°C
1
Operating Junction Temperature (T
J
)
at I
LOAD
= 500 mA
–40°C to +125°C
Soldering Conditions JEDEC J-STD-020
1
The maximum operating junction temperature (T
J(MAX)
) supersedes the
maximum operating ambient temperature (T
A(MAX)
). See the Thermal
Considerations section for more information.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination.
THERMAL CONSIDERATIONS
The maximum operating junction temperature (T
J(MAX)
)
supersedes the maximum operating ambient temperature
(T
A(MAX)
) because the ADP2125 can be damaged when the
junction temperature limits are exceeded. Monitoring ambient
temperature does not guarantee that T
J
is within the specified
temperature limits.
In applications with high power dissipation and poor PCB
thermal resistance, the maximum ambient temperature may
need to be derated. In applications with moderate power
dissipation and good PCB thermal resistance, the maximum
ambient temperature can exceed the maximum limit as long as
the junction temperature is within specification limits.
The operating junction temperature (T
J
) of the device is dependent
on the ambient temperature (T
A
), the power dissipation of the
device (P
D
), and the junction-to-ambient thermal resistance of
the package (θ
JA
). T
J
is calculated using the following formula:
T
J
= T
A
+ (P
D
× θ
JA
) (1)
See the Applications Information section for further infor-
mation on calculating the operating junction temperature
for a specific application.
THERMAL RESISTANCE
θ
JA
of the package is based on modeling and calculation using a
4-layer board. θ
JA
is highly dependent on the application and
board layout. In applications where high maximum power dissi-
pation exists, attention to thermal board design is required. The
value of θ
JA
may vary, depending on PCB material, layout, and
environmental conditions.
θ
JA
is specified for worst-case conditions, that is, a device
soldered on a circuit board for surface-mount packages. θ
JA
is determined according to JEDEC Standard JESD51-9 on a
4-layer printed circuit board (PCB).
Table
3. Thermal Resistance
Package Type θ
JA
Unit
6-Ball Bumped Bare Die, 4-Layer Board 120 °C/W
ESD CAUTION