Datasheet

ADP2121
Rev. B | Page 4 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
VIN to GND −0.3 V to +6 V
EN, MODE to GND −0.3 V to VIN
FB, SW to GND −0.3 V to VIN + 0.2 V
Operating Ambient Temperature Range
(I
LOAD
≤ 600 mA)
–40°C to +85°C
Operating Junction Temperature Range –40°C to + 125°C
Storage Temperature –45°C to +150°C
Soldering Conditions JEDEC J-STD-020
ESD (Electrostatic Discharge)
Human Body Model ±4 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADP2121 can be damaged when the junction
temperature limits are exceeded. Monitoring ambient tempera-
ture does not guarantee that the junction temperature (T
J
) is
within the specified temperature limits. In applications with
high power dissipation and poor PCB thermal resistance, the
maximum ambient temperature may need to be derated. In
applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits.
The junction temperature (T
J
) of the device is dependent on the
ambient temperature (T
A
), the power dissipation of the device
(P
D
), and the junction-to-ambient thermal resistance of the
package (θ
JA
). Maximum junction temperature (T
J
) is calculated
from the ambient temperature (T
A
) and power dissipation (P
D
)
using the following formula:
T
J
= T
A
+ (P
D
× θ
JA
)
The junction-to-ambient thermal resistance (θ
JA
) of the package
is based on modeling and calculation using a 2- and 4-layer
board. The junction-to-ambient thermal resistance is highly
dependent on the application and board layout. In applications
where high maximum power dissipation exists, close attention
to thermal board design is required.
The value of θ
JA
may vary, depending on PCB material, layout,
and environmental conditions. Refer to JEDEC JESD51-9 for
detailed information about board construction.
THERMAL RESISTANCE
The junction-to-ambient thermal resistance of the system (θ
JA
)
is specified for worst-case conditions, that is, a device soldered
in a circuit board for surface-mount packages.
Table
4.
Package Type θ
JA
Unit
6-Ball WLCSP
2-Layer Board 198 °C/W
4-Layer Board 105 °C/W
ESD CAUTION