Datasheet

ADP2121
Rev. B | Page 20 of 20
OUTLINE DIMENSIONS
021908-A
A
12
B
C
0.400 BSC
BALL PITCH
BOTTOM VIEW
(BALL SIDE UP)
0.940
0.900
0.860
1.340
1.300
1.260
TOP VIEW
(BALL SIDE DOWN)
A1 BALL
CORNER
0.660
0.600
0.540
0.430
0.400
0.370
0.280
0.260
0.240
0.230
0.200
0.170
0.075 NOM
COPLANARITY
0.800
BSC
Figure 59. 6-Ball Wafer Level Chip Scale Package (WLCSP)
(CB-6-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature
Range
Output
Voltage (V) Package Description
Package
Option
2
Branding
ADP2121ACBZ-1.8-R7 −40 °C to +85 °C 1.8 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-4 L92
ADP2121ACBZ-1.82R7 −40 °C to +85 °C 1.82 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-4 L7N
ADP2121ACBZ-1.85R7 −40 °C to +85 °C 1.85 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-4 L94
ADP2121ACBZ-1875R7 −40 °C to +85 °C 1.875 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-4 L95
ADP2121ACBZ-2.3-R7 −40 °C to +85 °C 2.3 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-4 L9G
ADP2121-1.8-EVALZ 1.8 Evaluation Board for 1.8 V
ADP2121-1.82-EVALZ 1.82 Evaluation Board for 1.82 V
ADP2121-1.85-EVALZ 1.85 Evaluation Board for 1.85 V
ADP2121-1.875EVALZ 1.875 Evaluation Board for 1.875 V
ADP2121-2.3-EVALZ 2.3 Evaluation Board for 2.3 V
1
Z = RoHS Compliant Part.
2
Halide free.
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D07407-0-1/11(B)