Datasheet

Data Sheet ADP2114
Rev. B | Page 5 of 40
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VDD to GND −0.3 V to +6 V
VIN1, VIN2, VIN3, VIN4, VIN5, VIN6 to
PGND1, PGND2, PGND3, PGND4
−0.3 V to +6 V
EN1, EN2, SCFG, FREQ, FB1, FB2, SYNC/
CLKOUT, PGOOD1, PGOOD2, V1SET,
V2SET, COMP1, COMP2, SS1, SS2 to GND
−0.3 V to (VDD + 0.3 V)
FB1, FB2 to GND −0.3V to +3.6V
SW1, SW2, SW3, SW4 to PGND1, PGND2,
PGND3, PGND4
−0.3 V to (VDD + 0.3 V)
PGND1, PGND2, PGND3, PGND4 to GND
±0.3 V
VIN1, VIN2, VIN3, VIN4, VIN5, VIN6 to VDD
±0.3 V
θ
JA
, JEDEC 1S2P PCB, Natural Convection
34°C/W
Operating Junction Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Maximum Soldering Lead
Temperature (10 sec)
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination.
ESD CAUTION