Datasheet

Data Sheet ADP2114
Rev. B | Page 37 of 40
OUTLINE DIMENSIONS
3.25
3.10 SQ
2.95
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
1
32
8
9
25
24
17
16
COPLANARITY
0.08
3.50 REF
0.50
BSC
PIN 1
INDICATOR
PIN 1
INDICATOR
0.30
0.25
0.18
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
S
EATING
PLANE
0.50
0.40
0.30
5.00
BSC SQ
4.75
BSC SQ
0.60 MAX
0.60 MAX
0.25 MIN
05-23-2012-A
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
Figure 85. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range
2
Package Description Package Option Ordering Quantity
ADP2114ACPZ-R7 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-2 1,500
ADP2114ACPZ-R2 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-2 250
ADP2114-2PH-EVALZ
Single output, dual-phase interleaved, 1.2 V at 4 A,
1.2 MHz switching frequency, forced PWM
ADP2114-EVALZ
Dual output, 3.3 V at 2 A and 1.8 V at 2 A, 600 kHz
switching frequency, pulse skip enabled
1
Z = RoHS Compliant Part.
2
Operating junction temperature is −40°C to +125°C.