Datasheet

ADP2109 Data Sheet
Rev. B | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
VIN, EN −0.4 V to +6.5 V
FB, SW to GND −1.0 V to (V
IN
+ 0.2 V)
Operating Ambient Temperature Range −40°C to +85°C
Operating Junction Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Lead Temperature Range −65°C to +150°C
Soldering Conditions JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to GND.
The ADP2109 can be damaged when the junction temperature
limits are exceeded. Monitoring ambient temperature does not
guarantee that the junction temperature (T
J
) is within the specified
temperature limits. In applications with high power dissipation
and poor thermal resistance, the maximum ambient tempera-
ture may have to be derated. In applications with moderate
power dissipation and low PCB thermal resistance, the max-
imum ambient temperature can exceed the maximum limit
as long as T
J
is within specification limits. T
J
of the device is
dependent on the ambient temperature (T
A
) of the device,
the power dissipation (PD) of the device, and the junction-to-
ambient thermal resistance (θ
JA
) of the package. Maximum T
J
is calculated from T
A
and PD using the following formula:
T
J
= T
A
+ (PD × θ
JA
)
THERMAL RESISTANCE
θ
JA
is specified for a device mounted on a JEDEC 2S2P PCB.
Table 4. Thermal Resistance
Package Type θ
JA
Unit
5-Ball WLCSP 105 °C/W
ESD CAUTION