Datasheet

Data Sheet ADP2109
Rev. B | Page 15 of 16
OUTLINE DIMENSIONS
021109-B
A
B
C
0.657
0.602
0.546
1.06
1.02
0.98
1.49
1.45
1.41
1
2
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
0.330
0.310
0.290
0.866
REF
0.022
REF
SEATING
PLANE
0.50
REF
0.355
0.330
0.304
0.280
0.250
0.220
COPLANARITY
0.04
0.50
BALL A1
IDENTIFIER
Figure 32. 5-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-5-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature
Range
Output
Voltage (V) Package Description
Package
Option Branding
ADP2109ACBZ-1.0-R7 –40°C to +125°C 1.0 5-Ball Wafer Level Chip Scale Package [WLCSP] CB-5-3 L9D
ADP2109ACBZ-1.2-R7 –40°C to +125°C 1.2 5-Ball Wafer Level Chip Scale Package [WLCSP] CB-5-3 L9E
ADP2109ACBZ- 1.5-R7 –40°C to +125°C 1.5 5-Ball Wafer Level Chip Scale Package [WLCSP] CB-5-3 LDA
ADP2109ACBZ-1.8-R7
–40°C to +125°C
1.8
5-Ball Wafer Level Chip Scale Package [WLCSP]
CB-5-3
L9F
ADP2109CB-1.8EVALZ Evaluation Board for 1.8 V
1
Z = RoHS Compliant Part.