Datasheet

Data Sheet ADP2109
Rev. B | Page 13 of 16
The peak-to-peak output voltage ripple for a chosen output
capacitor and inductor values is calculated using the following
equation:
( )
OUT
SW
RIPPLE
OUT
SW
IN
RIPPLE
Cf
I
CLf
V
V
××
=
××××π
=
822
Capacitors with lower equivalent series resistance (ESR) are
preferred to guarantee low output voltage ripple, as shown in the
following equation:
RIPPLE
RIPPLE
COUT
I
V
ESR ≤
The effective capacitance needed for stability, which includes
temperature and dc bias effects, i s 7 µF.
Table 7. Suggested 10 μF Capacitors
Vendor Type Model
Case
Size
Voltage
Rating (V)
Murata X5R GRM188R60J106 0603 6.3
Taiyo Yuden
X5R
JMK107BJ106
0603
6.3
TDK X5R C1608JB0J106K 0603 6.3
Input Capacitor
Higher value input capacitors help to reduce the input voltage
ripple and improve transient response.
Maximum input capacitor current is calculated using the
following equation:
IN
OUT
IN
OUT
MAXLOAD
CIN
V
VVV
II
)(
)(
−
≥
To minimize supply noise, place the input capacitor as close as
possible to the VIN pin of the ADP2109 IC. As with the output
capacitor, a low ESR capacitor is recommended.
The list of recommended capacitors is shown in Table 8.
Table 8. Suggested 4.7 μF Capacitors
Vendor Type Model
Case
Size
Voltage
Rating
(V)
Murata X5R GRM188R60J475ME19 0603 6.3
Taiyo Yuden X5R JMK107BJ475 0603 6.3
TDK X5R C1608X5R0J475 0603 6.3
THERMAL CONSIDERATIONS
Because of the high efficiency of the ADP2109, only a small
amount of power is dissipated inside the ADP2109 package,
which reduces thermal constraints.
However, in applications with maximum loads at high ambient
temperature, low supply voltage, and high duty cycle, the heat
dissipated in the package is great enough that it may cause the
junction temperature of the die to exceed the maximum junction
temperature of 125°C. If the junction temperature exceeds
150°C, the converter goes into thermal shutdown. It recovers
when the junction temperature falls below 130°C.
The junction temperature of the die is the sum of the ambient
temperature of the environment and the temperature rise of the
package due to power dissipation, as shown in the following
equation:
T
J
= T
A
+ T
R
where:
T
J
is the junction temperature.
T
A
is the ambient temperature.
T
R
is the rise in temperature of the package due to power
dissipation to it.
The rise in temperature of the package is directly proportional
to the power dissipation in the package. The proportionality
constant for this relationship is the thermal resistance from the
junction of the die to the ambient temperature, as shown in the
following equation:
T
R
= θ
JA
× PD
where:
T
R
is the rise of temperature of the package.
θ
JA
is the thermal resistance from the junction of the die to the
ambient temperature of the package.
PD is the power dissipation in the package.
PCB LAYOUT GUIDELINES
Poor layout can affect ADP2109 performance causing
electromagnetic interference (EMI) and electromagnetic
compatibility (EMC) problems, ground bounce, and voltage
losses. Poor layout can also affect regulation and stability.
A good layout is implemented using the following rules:
• Place the inductor, input capacitor, and output capacitor
close to the IC using short tracks. These components carry
high switching frequencies and the large tracks act like
antennas.
• Route the output voltage path away from the inductor and
SW node to minimize noise and magnetic interference.
• Maximize the size of ground metal on the component side
to help with thermal dissipation.
• Use a ground plane with several vias connecting to the
component side ground to further reduce noise interfe-
rence on sensitive circuit nodes.