Datasheet

ADP2105/ADP2106/ADP2107 Data Sheet
Rev. D | Page 6 of 36
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
IN, EN, SS, COMP, FB to AGND −0.3 V to +6 V
LX1, LX2 to PGND
−0.3 V to (V
IN
+ 0.3 V)
PWIN1, PWIN2 to PGND −0.3 V to +6 V
PGND to AGND −0.3 V to +0.3 V
GND to AGND −0.3 V to +0.3 V
PWIN1, PWIN2 to IN −0.3 V to +0.3 V
Operating Junction Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Soldering Conditions JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type θ
JA
Unit
16-Lead LFCSP_VQ/QFN 40 °C/W
Maximum Power Dissipation
1
W
BOUNDARY CONDITION
Natural convection, 4-layer board, exposed pad soldered to the PCB.
ESD CAUTION