Datasheet

Data Sheet ADP197
Rev. B | Page 13 of 16
OUTLINE DIMENSIONS
0.50 BSC
1.00
BSC
1.50
1.45
1.40
1.00
0.95
0.90
SEATING
PLANE
0.675
0.595
0.515
0.075
COPLANARITY
0.380
0.355
0.330
0.345
0.295
0.245
0.270
0.240
0.210
A1 BALL
CORNER
0.50
BSC
A
12
B
C
TOP VIEW
(BALL SIDE DOWN)
BOTTOM VIEW
(BALL SIDE UP)
081607-B
Figure 32. 6-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-6-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature
Range Package Description Package Option Branding
On/Off
Time (μs)
ADP197ACBZ-R7 −40°C to +85°C 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-2 87 300
ADP197ACBZ-01-R7 −40°C to +85°C 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-2 AP 20
ADP197CB-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.