Datasheet

Data Sheet ADP190/ADP191
Rev. E | Page 15 of 16
OUTLINE DIMENSIONS
0.800
0.760 SQ
0.720
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
A
1
2
B
BALL A1
IDENTIFIER
0.40
REF
0.660
0.600
0.540
END VIEW
0.280
0.260
0.240
0.430
0.400
0.370
SE
A
TING
PLANE
0.230
0.200
0.170
COPLANARITY
0.05
04-18-2012-A
Figure 39. 4-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-4-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
ADP190ACBZ-R7 −40°C to +85°C 4-Ball Wafer Level Chip Scale Package [WLCSP] CB-4-3 4D
ADP191ACBZ-R7 −40°C to +85°C 4-Ball Wafer Level Chip Scale Package [WLCSP] CB-4-3 4G
ADP190CB-EVALZ Evaluation Board
ADP191CB-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.