Datasheet

Data Sheet ADP1878/ADP1879
Rev. B | Page 5 of 40
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VREG to PGND, GND −0.3 V to +6 V
VIN, EN, PGOOD to PGND −0.3 V to +28 V
FB, COMP, RES, SS to GND −0.3 V to (VREG + 0.3 V)
DRVL to PGND −0.3 V to (VREG + 0.3 V)
SW to PGND −2.0 V to +28 V
BST to SW −0.6 V to (VREG + 0.3 V)
BST to PGND −0.3 V to +28 V
DRVH to SW −0.3 V to VREG
PGND to GND ±0.3 V
PGOOD Input Current 35 mA
θ
JA
(14-Lead LFCSP_WD)
4-Layer Board 30°C/W
Operating Junction Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Soldering Conditions JEDEC J-STD-020
Maximum Soldering Lead Temperature
(10 sec)
300°C
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to PGND.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Boundary Condition
In determining the values given in Table 2 and Table 3, natural
convection is used to transfer heat to a 4-layer evaluation board.
Table 3. Thermal Resistance
Package Type θ
JA
Unit
θ
JA
(14-Lead LFCSP_WD)
4-Layer Board 30 °C/W
ESD CAUTION
Stresses abo
v
e those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
de
v
ice reliability.