Datasheet

Data Sheet ADP1878/ADP1879
Rev. B | Page 39 of 40
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
Figure 96. 14-Lead Lead Frame Chip Scale Package [LFCSP_WD]
4 mm × 3 mm Body, Very Very Thin Dual
(CP-14-2)
Dimensions shown in millimeters
101309-A
COMPLIANT TO JEDEC STANDARDS MO-229-WEGD
BOTTOM VIEW
TOP VIEW END VIEW
SIDE VIEW
1 7
8
14
SEATING
PLANE
0.80
0.75
0.70
0.30
0.25
0.20
0.05 MAX
0.02 NOM
0.15 REF
0.10
REF
0.90
REF
0.30
REF
0.50 BSC
COPLANARITY
0.08
PIN 1 INDICATOR
(LASER MARKING)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
EXPOSED
PAD
0.50
0.40
0.30
1.80
1.70
1.55
3.40
3.30
3.15
3.10
3.00
2.90
4.10
4.00
3.90
0.20 MIN