Datasheet

ADP1874/ADP1875 Data Sheet
Rev. A | Page 6 of 44
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VREG, VREG_IN, TRACK to PGND, GND −0.3 V to +6 V
VIN, EN, PGOOD to PGND
−0.3 V to +28 V
FB, COMP, RES, SS to GND −0.3 V to (VREG + 0.3 V)
DRVL to PGND −0.3 V to (VREG + 0.3 V)
SW to PGND −2.0 V to +28 V
BST to SW −0.6 V to (VREG + 0.3 V)
BST to PGND −0.3 V to +28 V
DRVH to SW −0.3 V to VREG
PGND to GND ±0.3 V
PGOOD Input Current 20 mA
θ
JA
(16-Lead QSOP)
4-Layer Board 104°C/W
Operating Junction Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Soldering Conditions JEDEC J-STD-020
Maximum Soldering Lead Temperature
(10 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages
are referenced to PGND.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type θ
JA
Unit
θ
JA
(16-Lead QSOP)
4-Layer Board
104°
°C/W
BOUNDARY CONDITION
In determining the values given in Table 2 and Table 3, natural
convection is used to transfer heat to a 4-layer evaluation board.
ESD CAUTION