Datasheet

ADP1853 Data Sheet
Rev. 0 | Page 6 of 28
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VIN, EN, RAMP 21 V
FB, COMP, SS, TRK, FREQ, SYNC, VCCO,
PGOOD, CLKOUT
−0.3 V to +6 V
ILIM, SW, CS to PGND −0.3 V to +21 V
BST, DH to PGND −0.3 V to +28 V
DL to PGND −0.3 V to VCCO + 0.3 V
BST to SW
−0.3 V to +6 V
BST to PGND to PGND 20 ns Transients
32 V
SW, CS to PGND 20 ns Transients 25 V
DL, SW, CS, ILIM to PGND 20 ns
Negative Transients
−8 V
PGND to AGND −0.3 V to +0.3 V
PGND to AGND 20 ns Transients −8 V to +4 V
θ
JA
(Natural Convection)
1, 2
40°C/W
Operating Junction Temperature Range
3
−40°C to +125°C
Storage Temperature Range −65°C to +150°C
Maximum Soldering Lead Temperature 260°C
1
Measured with exposed pad attached to PCB.
2
Junction-to-ambient thermal resistance (θ
JA
) of the package was calculated
or simulated on multilayer PCB.
3
The junction temperature (T
J
) of the device is dependent on the ambient
temperature (T
A
) the power dissipation of the device (P
D
) and the junction to
ambient thermal resistance of the package (θ
JA
). Maximum junction
temperature is calculated from the ambient temperature and power
dissipation using the formula T
J
= T
A
+ P
D
× θ
JA
.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to GND.
ESD CAUTION