Datasheet

Data Sheet ADP1851
Rev. 0 | Page 23 of 24
OUTLINE DIMENSIONS
Figure 36. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-16-26)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADP1851ACPZ-R7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-16-26
ADP1851-EVALZ Evaluation Board: 1.8 V, 25 A Output
1
Z = RoHS Compliant Part.
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.
042709-A
1
0.65
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
0.50
0.40
0.30
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
PIN 1
INDICATOR
0.35
0.30
0.25
2.60
2.50 SQ
2.40
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.