Datasheet

Data Sheet ADP1850
Rev. A | Page 31 of 32
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
1
0.50
BSC
3.50 REF
BOTTOM VIEWTOP VIEW
PIN 1
INDI
C
ATOR
32
916
17
24
25
8
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
3.65
3.50 SQ
3.45
S
EATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
04-02-2012-A
Figure 48. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-11)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADP1850ACPZ-R7 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-11
ADP1850SP-EVALZ Evaluation Board in Single-Phase Mode with 14 A Output
ADP1850DP-EVALZ Evaluation Board in Dual-Phase Mode with 50 A Output
1
Z = RoHS Compliant Part.