Datasheet

ADP1829 Data Sheet
Rev. C | Page 28 of 28
OUTLINE DIMENSIONS
3.25
3.10 SQ
2.95
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
1
32
8
9
25
24
17
16
COPLANARITY
0.08
3.50 REF
0.50
BSC
PIN 1
INDICATOR
PIN 1
INDICATOR
0.30
0.25
0.18
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
S
EATING
PLANE
0.50
0.40
0.30
5.00
BSC SQ
4.75
BSC SQ
0.60 MAX
0.60 MAX
0.25 MIN
05-23-2012-A
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
Figure 36. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range
2
Package Description Package Option
ADP1829ACPZ-R7 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-2
ADP1829-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
2
Operating junction temperature range is −40°C to +125°C.
©2007–2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06784-0-10/12(C)