Datasheet

Data Sheet ADP1829
Rev. C | Page 25 of 28
PCB LAYOUT GUIDELINES
For PCB layout guidelines, refer to the AN-1119 Application
Note, Printed Circuit Board Layout Guidelines for Step-Down
Regulators, Optimizing for Low Noise Design with Dual Channel
Switching Controllers.
LFCSP PACKAGE CONSIDERATIONS
The LFCSP package has an exposed die paddle on the bottom
that efficiently conducts heat to the PCB. The thermal pad of
the LFCSP package provides a low thermal impedance path to
the PCB. Therefore, the PCB must be properly designed to
effectively conduct the heat away from the package. This is
achieved by adding thermal vias to the PCB, which provide a
thermal path to the inner or bottom layers.
Note that the thermal pad is attached to the die substrate, so the
planes that the thermal pad is connected to must be electrically
isolated or connected to GND.
The LFCSP is compliant with JEDECMO220 and MO229
outlines. Refer to the
AN-772 Application Note for LFCSP
package design and manufacturing guidelines.