Datasheet

ADP1828
Rev. C | Page 6 of 36
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
IN −0.3 V to +20.5 V
EN −0.3 V < IN + 0.3 V
PV, SYNC, FREQ, COMP, SS, FB, PGOOD,
CLKSET, CLKOUT, VREG, TRK
−0.3 V to +6 V
BST-to-GND, SW-to-GND −0.3 V to +30 V
BST-to-SW −0.3 V to +6 V
BST-to-GND, SW-to-GND, 50 ns transients +38 V
SW-to-GND, 30 ns negative transients −7 V
CSL-to-GND −1 V to +30 V
DH-to-GND
(SW − 0.3 V) to
(BST + 0.3 V)
DL-to-PGND
−0.3 V to
(PV + 0.3 V)
PGND-to-GND ±2 V
θ
JA
, 20-Lead QSOP on a Multilayer PCB
(Natural Convection)
1
83°C/W
θ
JA
, 20-Lead LFCSP on a Multilayer PCB
(Natural Convection)
1
35.6°C/W
Operating Junction Temperature
2
−40°C to +125°C
Storage Temperature −65°C to +150°C
Maximum Soldering Lead Temperature 260°C
1
Junction-to-ambient thermal resistance (θ
JA
) of the package was calculated
or simulated on a multilayer PCB.
2
The junction temperature, T
J
, of the device is dependent on the ambient
temperature, T
A
, the power dissipation of the device, P
D
, and the junction to
ambient thermal resistance of the package, θ
JA
. Maximum junction
temperature is calculated from the ambient temperature and power
dissipation using the formula T
J
= T
A
+ P
D
× θ
JA
.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified all other voltages
are referenced to GND.
ESD CAUTION