Datasheet

ADP1752/ADP1753 Data Sheet
Rev. F | Page 18 of 20
PCB LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by increas-
ing the amount of copper attached to the pins of the ADP1752/
ADP1753. However, as shown in Table 6, a point of diminishing
returns is eventually reached, beyond which an increase in the
copper size does not yield significant heat dissipation benefits.
Here are a few general tips when designing PCBs:
• Place the input capacitor as close as possible to the VIN
and GND pins.
• Place the output capacitor as close as possible to the VOUT
and GND pins.
• Place the soft start capacitor as close as possible to the SS pin.
• Connect the load as close as possible to the VOUT and
SENSE pins (ADP1754) or to the VOUT and ADJ pins
(ADP1755).
Use of 0603 or 0805 size capacitors and resistors achieves the
smallest possible footprint solution on boards where area is
limited.
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Figure 46. Evaluation Board
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Figure 47. Typical Board Layout—Top Side
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Figure 48. Typical Board Layout—Bottom Side