Datasheet

ADP172 Data Sheet
Rev. D | Page 16 of 20
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of the
ADP172. However, as can be seen from Table 6, a point of
diminishing returns is eventually reached, beyond which an
increase in the copper size does not yield significant heat
dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use of 0402 or 0603 size capacitors and
resistors achieves the smallest possible footprint solution for
boards on which area is limited.
06111-037
Figure 37. Example ADP172 PCB Layout