Datasheet

ADP1712/ADP1713/ADP1714
Rev. A | Page 14 of 16
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
140
0
0.5 5.0
V
IN
– V
OUT
(V)
T
J
(°C)
120
100
80
60
40
20
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
1mA
10mA
30mA
80mA
100mA
200mA
300mA
(LOAD CURRENT)
MAX T
J
(DO NOT OPERATE ABOVE THIS POINT)
06455-032
Figure 36. 500 mm
2
of PCB Copper, T
A
= 50°C
140
0
0.5 5.0
V
IN
– V
OUT
(V)
T
J
(°C)
120
100
80
60
40
20
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
1mA
10mA
30mA
80mA
100mA
200mA
300mA
(LOAD CURRENT)
MAX T
J
(DO NOT OPERATE ABOVE THIS POINT)
06455-033
Figure 37. 100 mm
2
of PCB Copper, T
A
= 50°C
140
0
0.5 5.0
V
IN
– V
OUT
(V)
T
J
(°C)
120
100
80
60
40
20
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
1mA
10mA
30mA
80mA
100mA
200mA
300mA
(LOAD CURRENT)
MAX T
J
(DO NOT OPERATE ABOVE THIS POINT)
06455-034
Figure 38. 0 mm
2
of PCB Copper, T
A
= 50°C
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP1712/
ADP1713/ADP1714. However, as can be seen from Table 5, a
point of diminishing returns eventually is reached, beyond
which an increase in the copper size does not yield significant
heat dissipation benefits.
Place the input capacitor as close as possible to the IN and GND
pins. Place the output capacitor as close as possible to the OUT
and GND pins. For the ADP1712 adjustable version, place the
soft-start capacitor as close as possible to the SS pin. For the
ADP1713, place the internal reference bypass capacitor as close
as possible to the BYP pin. Use of 0402 or 0603 size capacitors
and resistors achieves the smallest possible footprint solution on
boards where area is limited.
GND (BOTTOM)
GND (TOP)
IN
EN
R2
R1C3
OUT
C2C1
ADP1712/
ADP1713/
ADP1714
SS/
ADJ/
BYP/
TRK
06455-035
Figure 39. Example PCB Layout