Datasheet

ADP1710/ADP1711
Rev. 0 | Page 12 of 16
140
0
0.5 5.0
V
IN
– V
OUT
(V)
T
J
(°C)
120
100
80
60
40
20
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
1mA
10mA
30mA
80mA
100mA
125mA
150mA
(LOAD CURRENT)
MAX T
J
(DO NOT OPERATE ABOVE THIS POINT)
06310-026
Figure 26. 500 mm
2
of PCB Copper, T
A
= 50°C
140
0
0.5 5.0
V
IN
– V
OUT
(V)
T
J
(°C)
120
100
80
60
40
20
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
1mA
10mA
30mA
80mA
100mA
125mA
150mA
(LOAD CURRENT)
MAX T
J
(DO NOT OPERATE ABOVE THIS POINT)
06310-027
Figure 27. 100 mm
2
of PCB Copper, T
A
= 50°C
140
0
0.5 5.0
V
IN
– V
OUT
(V)
T
J
(°C)
120
100
80
60
40
20
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
1mA
10mA
30mA
80mA
100mA
125mA
150mA
(LOAD CURRENT)
MAX T
J
(DO NOT OPERATE ABOVE THIS POINT)
06310-028
Figure 28. 0 mm
2
of PCB Copper, T
A
= 50°C
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP1710/
ADP1711. However, as can be seen from
Table 5, a point of
diminishing returns eventually is reached, beyond which an
increase in the copper size does not yield significant heat
dissipation benefits.
Place the input capacitor as close as possible to the IN and GND
pins. Place the output capacitor as close as possible to the OUT
and GND pins. For ADP1711, place the internal reference
bypass capacitor as close as possible to the BYP pin. Use of 0402
or 0603 size capacitors and resistors achieves the smallest
possible footprint solution on boards where area is limited.
GND (BOTTOM)
GND (TOP)
ADP1710/
ADP1711
IN
EN
R2
R1
C3
OUT
C2C1
06310-029
Figure 29. Example PCB Layout