Datasheet

ADP1706/ADP1707/ADP1708
Rev. 0 | Page 16 of 20
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETER; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
060506-A
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.050)
0.40 (0.016)
0.50 (0.020)
0.25 (0.010)
45°
1.75 (0.069)
1.35 (0.053)
1.65 (0.065)
1.25 (0.049)
SEATING
PLANE
85
41
5.00 (0.197)
4.90 (0.193)
4.80 (0.189)
4.00 (0.157)
3.90 (0.154)
3.80 (0.150)
1.27 (0.05)
BSC
6.20 (0.244)
6.00 (0.236)
5.80 (0.228)
0.51 (0.020)
0.31 (0.012)
COPLANARITY
0.10
TOP VIEW
3.098 (0.122)
BOTTOM VIEW
(PINS UP)
2.41 (0.095)
0.10 (0.004)
MAX
Figure 43. 8-Lead Standard Small Outline Package, with Expose Pad [SOIC_N_EP]
Narrow Body
(RD-8-2)
Dimensions shown in millimeters and (inches)
0
61507-B
1
EXPOSED
PA D
(BOTTOM VIEW)
0.50
BSC
PIN 1
INDICATOR
0.50
0.40
0.30
TOP
VIEW
12° MAX
0.70 MAX
0.65 TYP
0.90 MAX
0.85 NOM
0.05 MAX
0.01 NOM
0.20 REF
1.89
1.74
1.59
4
1.60
1.45
1.30
3.25
3.00 SQ
2.75
2.95
2.75 SQ
2.55
5
8
PIN 1
INDICATOR
SEATING
PLANE
0.30
0.23
0.18
0.60 MAX
0.60 MAX
Figure 44. 8-Lead Frame Chip Scale Package [LFCSP_VD]
3 mm × 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters