Datasheet

ADP1660 Data Sheet
Rev. 0 | Page 26 of 28
OUTLINE DIMENSIONS
A
B
C
D
0.660
0.600
0.540
1.695
1.655
1.615
2.060
2.020
1.980
1
2
3
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
END VIEW
0.360
0.320
0.280
1.50
REF
1.00
REF
0.50
REF
BALL A1
IDENTIFIER
09-07-2012-A
SEATING
PLANE
0.270
0.240
0.210
COPLANARITY
0.05
Figure 33. 12-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-12-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
2
Branding
ADP1660ACBZ-R7 −40°C to +125°C 12-Ball Wafer Level Chip Scale Package [WLCSP] CB-12-7 LM7
ADP1660CB-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
2
This package option is halide free.