Datasheet

ADP1650
Rev. C | Page 29 of 32
OUTLINE DIMENSIONS
020409-B
A
B
C
D
0.660
0.602
0.544
1.54
1.50
1.46
2.04
2.00
1.96
1
2
3
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
0.330
0.310
0.290
1.50
REF
SEATING
PLANE
1.00
REF
0.50
REF
0.380
0.352
0.324
0.280
0.250
0.220
0.04 MAX
COPLANARITY
0.022
REF
BALL A1
IDENTIFIER
Figure 47. 12-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-12-4)
Dimensions shown in millimeters
2.48
2.38
2.23
0.50
0.40
0.30
121009-A
TOP VIEW
10
1
6
5
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.74
1.64
1.49
0.20 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
P
I
N
1
I
N
D
I
C
A
T
O
R
(
R
0
.
1
5
)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 48. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-10-9)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
2
Branding
ADP1650ACBZ-R7 −40°C to +125°C 12-Ball Wafer Level Chip Scale Package [WLCSP] CB-12-4 LE4
ADP1650ACPZ-R7 −40°C to +125°C 10-Lead Frame Chip Scale Package [LFCSP_WD] CP-10-9 LGX
ADP1650CB-EVALZ Evaluation Board WLCSP Package
ADP1650CP-EVALZ Evaluation Board LFCSP Package
1
Z = RoHS Compliant Part.
2
This package option is halide free.