Datasheet

ADP1649 Data Sheet
Rev. 0 | Page 6 of 28
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
VIN, SDA, SCL, EN, GPIO1, GPIO2, STROBE,
LED_OUT, SW, VOUT to Power Ground
−0.3 V to +6 V
PGND to SGND −0.3 V to +0.3 V
Ambient Temperature Range (T
A
) −40°C to +85°C
Junction Temperature Range (T
J
) −40°C to +125°C
Storage Temperature JEDEC J-STD-020
ESD Models
Human Body ±2000 V
Charged Device
±500 V
Machine ±150 V
THERMAL DATA
Exceeding the junction temperature limits may damage the
ADP1649. Monitoring T
A
does not guarantee that T
J
is within
the specified temperature limits. In applications with high power
dissipation and poor thermal resistance, the maximum T
A
may
need to be derated. In applications with moderate power dissipa-
tion and low printed circuit board (PCB) thermal resistance, the
maximum T
A
can exceed the maximum limit as long as the T
J
is
within specification limits. T
J
of the device is dependent on the
T
A
, the power dissipation (PD) of the device, and the junction-
to-ambient thermal resistance (θ
JA
) of the package. Maximum T
J
is calculated from T
A
and PD using the following formula:
T
J
= T
A
+ (PD × θ
JA
)
THERMAL RESISTANCE
θ
JA
of the package is based on modeling and calculation using
a 4-layer board. θ
JA
is highly dependent on the application and
board layout. In applications where high maximum power dissi-
pation exists, attention to thermal board design is required. The
value of θ
JA
may vary, depending on PCB material, layout, and
environmental conditions. The specified value of θ
JA
is based
on a 4-layer, 4 in × 3 in, 2½ oz copper board, per JEDEC
standards. For more information, see the AN-617 Application
Note, MicroCSP™ Wafer Level Chip Scale Package.
θ
JA
is specified for a device mounted on a JEDEC 2s2p PCB.
Table 5. Thermal Resistance
Package Type θ
JA
Unit
12-Ball WLCSP
75
°C/W
ESD CAUTION
Stresses a bove those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.