Datasheet

ADP1649 Data Sheet
Rev. 0 | Page 28 of 28
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
Figure 43. 12-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range
Package Description
Package Option
2
ADP1649ACBZ-R7
−40°C to +125°C
12-Ball Wafer Level Chip Scale Package [WLCSP]
CB-12-4
ADP1649CB-EVALZ Evaluation Board WLCSP Package
1
Z = RoHS Compliant Part.
2
This package option is halide free.
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
020409-B
A
B
C
D
0.660
0.602
0.544
1.54
1.50
1.46
2.04
2.00
1.96
1
2
3
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
0.330
0.310
0.290
1.50
REF
SEATING
PLANE
1.00
REF
0.50
REF
0.380
0.352
0.324
0.280
0.250
0.220
0.04 MAX
COPLANARITY
0.022
REF
BALL A1
IDENTIFIER
©2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered
trademarks are the property of their
respective owners.
D10779-0-7/12(0)
www.analog.com/ADP1649