Datasheet

Data Sheet ADP1621
Rev. B | Page 5 of 32
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
IN to GND −0.3 V to V
SHUNT
FB, COMP, SDSN, FREQ, GATE to GND
−0.3 V to (V
IN
+ 0.3 V)
CS to GND −5 V to +33 V
PIN to PGND −0.3 V to V
SHUNT
Supply Current into IN 25 mA
Supply Current into PIN 35 mA
Storage Temperature Range −55°C to +150°C
Junction Operating Temperature Range
1
−55°C to +150°C
Junction Storage Temperature Range −55°C to +150°C
Lead Temperature (Soldering, 10 sec) 300°C
Package Power Dissipation
1
(T
J,MAX
− T
A
)/θ
JA
1
In applications where high power dissipation and poor package thermal
resistance are present, the maximum ambient temperature may need to be
derated. Maximum ambient temperature (T
A,MAX) is dependent on the
maximum operating junction temperature (T
J,MAX = 150
o
C), the maximum
power dissipation of the device in the application (P
D,MAX), and the junction-
to-ambient thermal resistance of the package in the application (θ
JA), is given
by the following equation: T
A,MAX = TJ,MAX - -- (θJA x PD,MAX).
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to GND.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type θ
JA
Unit
10-lead MSOP on a 2-layer PCB 200 °C/W
10-lead MSOP on a 4-layer PCB 172 °C/W
Junction-to-ambient thermal resistance of the package is based
on modeling and calculation using 2-layer and 4-layer boards,
and natural convection. The junction-to-ambient thermal
resistance is application- and board-layout dependent. In
applications where high maximum power dissipation exists,
attention to thermal dissipation issues in board design is
required.
ESD CAUTION