Datasheet

Data Sheet ADP1614
Rev. A | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VIN, EN, FB, FREQ to GND −0.3 V to +6 V
CLRES to GND −0.3 V to VIN
COMP to GND 1.0 V to 1.6 V
SS to GND −0.3 V to +1.3 V
SW to GND 21 V
Operating Junction Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Soldering Conditions
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination.
THERMAL RESISTANCE
The junction-to-ambient thermal resistance (θ
JA
) of the package
is specified for the worst-case conditions, that is, a device soldered
in a circuit board for surface-mount packages. The θ
JA
is highly
dependent on the application and board layout. In applications
where high maximum power dissipation exists, attention to
thermal board design is required. The value of θ
JA
may vary,
depending on the printed circuit board (PCB) material, layout,
and environmental conditions.
The boundary conditions for the thermal resistance of the
ADP1614 are modeled under natural convection cooling at
25°C ambient temperature, JESD 51-9, and 1 W power input on a
4-layer board.
Table 3. Thermal Resistance
1
Package Type θ
JA
θ
JC
Unit
10-Lead LFCSP
47
7.22
°C/W
1
Thermal numbers per JEDEC standard JESD 51-9.
ESD CAUTION