Datasheet

ADP1612/ADP1613 Data Sheet
Rev. D | Page 4 of 28
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VIN, EN, FB to GND −0.3 V to +6 V
FREQ to GND −0.3 V to V
IN
+ 0.3 V
COMP to GND 1.0 V to 1.6 V
SS to GND −0.3 V to +1.3 V
SW to GND 21 V
Operating Junction Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Soldering Conditions
JEDEC J-STD-020
ESD (Electrostatic Discharge)
Human Body Model ±5 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination.
THERMAL RESISTANCE
Junction-to-ambient thermal resistance (θ
JA
) of the package is
specified for the worst-case conditions, that is, a device soldered
in a circuit board for surface-mount packages. The junction-to-
ambient thermal resistance is highly dependent on the application
and board layout. In applications where high maximum power
dissipation exists, attention to thermal board design is required.
The value of θ
JA
may vary, depending on PCB material, layout,
and environmental conditions.
Table 3.
Package Type θ
JA
θ
JC
Unit
8-Lead MSOP
2-Layer Board
1
206.9 44.22 °C/W
4-Layer Board
1
162.2 44.22 °C/W
1
Thermal numbers per JEDEC standard JESD 51-7.
BOUNDARY CONDITION
Modeled under natural convection cooling at 25°C ambient
temperature, JESD 51-7, and 1 W power input with 2- and
4-layer boards.
ESD CAUTION