Datasheet

ADP1607 Data Sheet
Rev. C | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VIN, VOUT to GND −0.3 V to +3.6 V
FB to GND −0.3 V to +1.4 V
EN, SW to GND (when VIN ≥ VOUT) −0.3 V to VIN + 0.3 V
EN, SW to GND (when VIN < VOUT) −0.3 V to VOUT + 0.3 V
EPAD to GND −0.3 V to + 0.3 V
Operating Ambient Temperature Range −40°C to +85°C
Operating Junction Temperature Range −40°C to +90°C
Storage Temperature Range −65°C to +150°C
Soldering Conditions JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination.
THERMAL OPERATING RANGES
The ADP1607 can be damaged when the junction temper-
ature limits are exceeded. The maximum operating junction
temperature (T
J(MAX)
) takes precedence over the maximum
operating ambient temperature (T
A(MAX)
). Monitoring ambient
temperature does not guarantee that the junction temperature
(T
J) is within the specified temperature limits.
In applications with high power dissipation and poor PCB
thermal resistance, the maximum ambient temperature may
need to be derated. In applications with moderate power
dissipation and low PCB thermal resistance, the maximum
ambient temperature can exceed the maximum limit as long
as the junction temperature is within specification limits.
The junction temperature T
J
of the device is dependent on the
ambient temperature (T
A
), the power dissipation of the device
(P
D
), and the junction-to-ambient thermal resistance of the
package (θ
JA
). Maximum junction temperature (T
J
) is calculated
from the ambient temperature (T
A
) and power dissipation (P
D
)
using the following formula:
T
J
= T
A
+ (P
D
× θ
JA
)
THERMAL RESISTANCE
Junction-to-ambient thermal resistance (θ
JA
) of the package
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. The
junction-to-ambient thermal resistance is highly dependent
on the application and board layout. In applications where high
maximum power dissipation exists, attention to thermal board
design is required. The value of θ
JA
may vary, depending on
PCB material, layout, and environmental conditions.
θ
JA
and θ
JC
(junction to case) are determined according to
JESD51-9 on a 4-layer PCB with natural convection cooling
and the exposed pad soldered to the board with thermal vias.
Table 3.
Package Type θ
JA
θ
JC
Unit
6-Lead LFCSP 66.06 4.3 °C/W
ESD CAUTION