Datasheet

ADP150 Data Sheet
Rev. B | Page 18 of 20
OUTLINE DIMENSIONS
100708-A
*
COMPLIANT TO JEDEC STANDARDS MO-193-AB WITH
THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS.
1.60 BSC
2.80 BSC
1.90
BSC
0.95 BSC
0.20
0.08
0.60
0.45
0.30
8°
4°
0°
0.50
0.30
0.10 MAX
*
1.00 MAX
*
0.90 MAX
0.70 MIN
2.90 BSC
54
123
SEATING
PLANE
Figure 49. 5-Lead Thin Small Outline Transistor Package [TSOT]
(UJ-5)
Dimensions show in millimeters
0.800
0.760 SQ
0.720
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
A
12
B
BALL A1
IDENTIFIER
0.40
REF
0.660
0.600
0.540
END VIEW
0.280
0.260
0.240
0.430
0.400
0.370
SEATING
PLANE
0.230
0.200
0.170
COPLANARITY
0.05
04-18-2012-A
Figure 50.4-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-4-3)
Dimensions show in millimeters