Datasheet

Data Sheet ADP124/ADP125
Rev. C | Page 15 of 20
JUNCTION TEMPERATURE CALCULATIONS
08476-034
25
35
45
55
65
75
85
95
105
115
125
135
145
0
0.2
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
JUNCTION TEMPERATURE (°C)
TOTAL POWER DISSIPATION (W)
6400 mm
2
500 mm
2
25 mm
2
T
J
MAX
Figure 36. Junction Temperature vs. Power Dissipation and copper area,
MSOP, T
A
= 25°C
08476-035
25
35
45
55
65
75
85
95
105
115
125
135
145
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
JUNCTION TEMPERATURE (°C)
TOTAL POWER DISSIPATION (W)
6400 mm
2
500 mm
2
25 mm
2
T
J
MAX
Figure 37. Junction Temperature vs. Power Dissipation and copper area,
LFCSP, T
A
= 25°C
50
60
70
80
90
100
110
120
130
140
0 0.2
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
JUNCTION TEMPERATURE (°C)
TOTAL POWER DISSIPATION (W)
08476-036
6400 mm
2
500 mm
2
25 mm
2
T
J
MAX
Figure 38. Junction Temperature vs. Power Dissipation and copper area,
MSOP, T
A
= 50°C
50
60
70
80
90
100
110
120
130
140
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
JUNCTION TEMPERATURE (°C)
TOTAL POWER DISSIPATION (W)
08476-037
6400 mm
2
500 mm
2
25 mm
2
T
J
MAX
Figure 39. Junction Temperature vs. Power Dissipation and copper area,
LFCSP, T
A
= 50°C
08476-038
JUNCTION TEMPERATURE (°C)
TOTAL POWER DISSIPATION (W)
0
20
40
60
80
100
120
140
0 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50
T
B
= 25°C
T
B
= 50°C
T
B
= 65°C
T
B
= 85°C
T
J
MAX
Figure 40. Junction Temperature vs. Power Dissipation, MSOP package
at various Board Temperatures
08476-039
JUNCTION TEMPER
ATURE (°C)
TOT
AL POWER DISSIPATION (W)
0
20
40
60
80
100
120
140
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
4.5
T
B
= 25°C
T
B
= 50°C
T
B
= 65°C
T
B
= 85°C
T
J
MAX
Figure 41. Junction Temperature vs. Power Dissipation, LFCSP package
at various Board Temperatures