Datasheet

Data Sheet ADP122/ADP123
Rev. E | Page 19 of 24
PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP122/ADP123.
However, as shown in Table 6, a point of diminishing returns
eventually is reached, beyond which an increase in the copper
size does not yield significant heat dissipation benefits.
The input capacitor should be placed as close as possible to the
VIN and GND pins, and the output capacitor should be placed
as close as possible to the VOUT and GND pins. Use of 0402 or
0603 size capacitors and resistors achieves the smallest possible
footprint solution on boards where the area is limited.
08399-041
Figure 52. Example ADP122 PCB Layout
08399-042
Figure 53. Example ADP123 PCB Layout