Datasheet

Data Sheet ADP121
Rev. G | Page 17 of 20
140
120
100
80
60
40
20
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
V
IN
– V
OUT
(V)
JUNCTION TEMPERATURE, T
J
(°C)
06901-048
MAX JUNCTION TEMPERATURE
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 25mA
I
LOAD
= 50mA
I
LOAD
= 75mA
I
LOAD
= 100mA
I
LOAD
= 150mA
Figure 46. TSOT, 100 mm
2
of PCB Copper, Board Temperature = 85°C
140
120
100
80
60
40
20
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
V
IN
– V
OUT
(V)
JUNCTION TEMPERATURE, T
J
(°C)
06901-049
MAX JUNCTION TEMPERATURE
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 25mA
I
LOAD
= 50mA
I
LOAD
= 75mA
I
LOAD
= 100mA
I
LOAD
= 150mA
Figure 47. WLCSP, 100 mm
2
of PCB Copper, Board Temperature = 85°C
PCB LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP121. However,
as can be seen from Table 6 and Table 7, a point of diminishing
returns is eventually reached, beyond which an increase in the
copper size does not yield significant heat dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use 0402 or 0603 size capacitors and
resistors to achieve the smallest possible footprint solution on
boards where area is limited.
VIN VOUT
GND
EN
GND
GNDGND
06901-034
C2C1
U1
J1
ANALOG DEVICES
ADP121-xx-EVALZ
Figure 48. Example of TSOT PCB Layout
06901-050
Figure 49. Example of WLCSP PCB Layout—Top Side
06901-051
Figure 50. Example of WLCSP PCB Layout—Bottom Side